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New High Accuracy Current Sense Amps Compatible with Both Negative and High Voltages

　　ROHM has developed a new lineup of high accuracy current sense amps – the BD1423xFVJ-C and the BD1422xG-C. They are qualified under the AEC-Q100 automotive reliability standard. The BD1423xFVJ-C series, offered in the TSSOP-B8J package, supports input voltages up to +80V, making it ideal for high-voltage environments such as 48V DC-DC converters, redundant power supplies, auxiliary batteries, and electric compressors. The series includes three models with different gain settings: BD14230FVJ-C, BD14231FVJ-C and BD14232FVJ-C.　　For lower voltage use cases, the BD1422xG-C, available in the compact SSOP6 package, supports input voltages up to +40V. This makes them suitable for automotive applications requiring space-saving designs, such as current monitoring and protection (overcurrent) in 5V/12V power supply networks used in body and drivetrain domains. Like its high-voltage counterpart, this series also consists of three different gain options: BD14220G-C, BD14221G-C and BD14222G-C.　　In recent years, alongside conventional 5V/12V power supplies, the automotive market has seen a growing adoption of 48V systems fueled by the rising popularity of electric vehicles. Furthermore, as vehicle functionality becomes more advanced, the need for precise monitoring and control across a wide range of applications continues to increase, placing a greater importance on high-accuracy current sensing.　　A current sense amp indirectly measures the current flowing through a circuit by amplifying the miniscule voltage drop across a shunt resistor. The amplified signal is then sent to an ADC or comparator for system control and monitoring. ROHM’s automotive-grade current sense amps meet market demands by leveraging proven analog expertise. This enables high-accuracy current sensing with compatibility for both negative and high voltage environments, contributing to improved safety and reliability in automotive applications, particularly electric vehicles.　　These new products achieve greater space efficiency by integrating most of current sensing circuitry, typically comprised of an operational amplifier and discrete components, int o a single package. As a result, current detection is possible by simply connecting a shunt resistor. The devices also feature a two-stage amplifier configuration, consisting of a chopper amplifier at the input and an auto-zero amplifier at the output. Internal resistor matching for gain setting ensures stable, accurate current sensing (±1%) while minimizing the effects of temperature variations.　　Furthermore, current detection accuracy is maintained even when an external RC filter circuit added for noise suppression, significantly reducing design complexity and development time. Additional features include -14V negative voltage tolerance that supports back electromotive force, reverse connection, and negative voltage input.　　Going forward, ROHM will continue to deliver optimal solutions that contribute to higher precision and enhanced reliability in automotive equipment.　　Application Examples　　• BD1423xFVJ-C (for 48V systems): Redundant power supplies, auxiliary batteries, DC-DC converters, and electric compressors, and the like　　• BD1422xG-C (for 5V/12V systems): Body DCUs (Domain Control Units) / ECUs (Electronic Control Units), etc.　　Terminology　　AEC-Q100 Automotive Reliability Standard　　AEC stands for Automotive Electronics Council, a reliability standard for automotive electronic components established by major automotive manufacturers and US electronic component makers. Q100 is a standard that specifically applies to integrated circuits (ICs).　　Shunt Resistor　　A resistor connected in series in the current path to detect the current in the circuit by measuring the potential difference across it.　　Chopper Amp　　An amp circuit designed to minimize signal offset and noise, primarily used for accurately amplifying low-frequency and weak DC signals.　　Auto-Zero Amp　　An amp that automatically compensates for offset voltage (unwanted noise and errors) by continuously sampling and correcting it during operation. This ensures high signal accuracy, making it ideal for applications that demand ultra-precise measurement and signal processing.

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ROHM

Release time：2025-06-13 16:56 reading：221 Continue reading>>

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ROHM Builds the Future of AI with Optimized Solutions for NVIDIA 800V Architecture

　　As artificial intelligence continues to redefine the boundaries of computing, the infrastructure powering these advancements must evolve in parallel. A recognized leader in power semiconductor technology, ROHM is proud to be among the key silicon providers supporting NVIDIA’s new 800 V High Voltage Direct Current (HVDC) architecture. This marks a pivotal shift in data center design, enabling megawatt-scale AI factories that are more efficient, scalable, and sustainable.　　ROHM’s power device portfolio spans both silicon and wide bandgap technologies, including silicon carbide (SiC) and gallium nitride (GaN), offering a strategic path for data center designers. The company’s silicon MOSFETs are already widely adopted across automotive and industrial sectors, providing a cost-effective and reliable solution for today’s power conversion needs. These are ideal for applications where price, efficiency, and reliability must be balanced, making them a strong fit for transitional stages of AI infrastructure development.　　A standout example is the RY7P250BM, a 100V power MOSFET endorsed by major global cloud providers designed specifically for hot-swap circuits in 48V power systems—an essential component in AI servers. Key features include best-in-class SOA (Safe Operating Area) performance and ultra-low ON resistance (1.86 mΩ) in a compact 8080 package. These characteristics help reduce power loss and improve system reliability—crucial requirements in high-density, high-availability cloud platforms. As data centers transition from 12V to 48V and beyond, hot-swap capability becomes critical for maintaining uptime and protecting against inrush currents.　　Industrial-grade rectification with minimal losses is an area where ROHM’s SiC devices excel and align with NVIDIA’s plans to begin large-scale deployment of its 800V HVDC data center architecture to power 1 MW compute racks and beyond. At the heart of NVIDIA’s new infrastructure is the conversion of 13.8kV AC from the grid directly into 800V DC. The initiative is designed to address the inefficiencies of traditional 54V rack power systems, which are constrained by physical space, copper overload, and conversion losses.　　ROHM’s SiC MOSFETs deliver superior performance in high-voltage, high-power environments, offering higher efficiency through reduced switching and conduction losses, greater thermal stability for compact, high-density systems, and proven reliability in mission-critical applications. These characteristics align perfectly with the requirements of the NVIDIA 800 V HVDC architecture, which aims to reduce copper usage, minimize energy losses, and simplify power conversion across the data center.　　Complementing SiC, ROHM is advancing gallium nitride technologies under the EcoGaN™ brand. While SiC is best-suited for high voltage, high current applications, GaN offers exceptional performance in the 100V to 650V range, with superior breakdown field strength, low ON resistance, and ultra-fast switching. ROHM’s broad EcoGaNTM lineup includes 150V and 650V GaN HEMTs, gate drivers, and integrated power stage ICs. At the same time, proprietary Nano Pulse ControlTM technology further improves switching performance, reducing pulse widths to as low as 2ns. These innovations support the growing demand for smaller, more efficient power systems in AI data centers.　　Beyond discrete devices, ROHM offers a lineup of high-power SiC modules, including top-side cooling molded packages such as the HSDIP20, equipped with advanced 4th Gen SiC chips. These 1200V SiC modules are optimized for LLC topologies in AC-DC converters and primary-side applications in DC-DC converters. Engineered for high-efficiency, high-density power conversion, they are particularly well-suited for the centralized power systems envisioned in NVIDIA’s architecture. Their robust thermal performance and scalability make them ideal for 800 V busways and MW-scale rack configurations.　　The transition to an 800V HVDC infrastructure is a collaborative effort. ROHM is committed to working closely with industry leaders like NVIDIA as well as data center operators and power system designers to provide the foundational silicon technologies needed for this next generation of AI factories. Our expertise in power semiconductors, particularly in wide-bandgap materials like SiC and GaN, positions us as a key partner in developing solutions that are not only powerful but also contribute to a more sustainable and energy-efficient digital future.

Key word：

ROHM

Release time：2025-06-13 16:52 reading：224 Continue reading>>

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Fibocom Releases 5G AI Mobile Hotspot Solution, Unlocking Intelligent Future for Mobile Broadband Devices

　　As 5G and AI technologies continue to converge, demand is growing for stable, high-speed, and intelligent mobile networks across various scenarios—from business travel and outdoor operations to global connectivity. Fibocom’s latest 5G AI Mobile Hotspot solution redefines the mobile broadband experience with cutting-edge technology and forward-thinking design.　　Powered by Qualcomm’s advanced 4nm QCM4490 platform, the solution combines smartphone-grade ultra-low power consumption with precision circuit design. This results in a powerful yet energy-efficient platform that balances high performance with cost optimization.　　In terms of connectivity, the solution supports 3GPP Release 16 and NR 2CC 120MHz. It delivers a downlink speed of up to 2.3 Gbps in SA mode and 2.5 Gbps in NSA mode. Customers can flexibly configure the solution with either AX3600-based Wi-Fi 6E or BE5800-based Wi-Fi 7 options. It supports dual-band simultaneous (DBS) modes of 2.4GHz+5GHz or 2.4GHz+6GHz, as well as high-band simultaneous (HBS) mode of 5GHz+6GHz.　　Tailored for Mobile Hotspot applications, the solution runs an optimized Android 13 OS, significantly boosting system performance while reducing power consumption. With USB 3.1 support and a theoretical data transfer rate of up to 5 Gbps, it’s well-suited not only for 5G Mobile Hotspot devices but also for other mobile broadband terminals such as USB dongles.　　Crucially, the solution leverages the QCM4490’s heterogeneous computing architecture, featuring a robust 8-core CPU (2x Cortex-A78 @ 2.4GHz + 6x Cortex-A55 @ 2.0GHz) and integrated Adreno 613 GPU (@ 1010MHz). Compared to GPU-less solutions, this powerful combination enables efficient on-device AI processing, expanding the possibilities for more edge intelligence applications. Internal tests have demonstrated the successful deployment of large-scale open-source AI models such as Qwen-1.8 B-Chat.　　From business office to global travel these mobile broadband applied scenarios, Fibocom’s cost-effective 5G AI Mobile Hotspot solution—with optional Wi-Fi 7 support—paves the way for a new era of AI-enhanced mobile broadband.

Key word：

Fibocom

Release time：2025-06-06 15:38 reading：273 Continue reading>>

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TAIYO YUDEN: World's First Multilayer Metal Power Inductor Capable of Withstanding Temperatures up to 165°C

　　TAIYO YUDEN CO., LTD. has commercialized four items, including the multilayer metal power inductor MCOIL™ "LACNF2012KKTR24MAB" (2.0 x 1.25 x 1.0 mm, maximum height value shown), which complies with the "AEC-Q200" reliability qualification test standard for passive automotive components. Through advancements made in our proprietary metal materials and multilayer construction methods, we have achieved an upper operating temperature limit of 165°C for a multilayer metal power inductor, a world’s first *1 .　　These products are used as choke coils in DC-DC converters used in automotive engine ECUs, control systems such as BMS, safety systems such as ABS, body-related systems such as ADAS, and information systems such as instrument clusters.　　By extending the upper operating temperature limit range of our conventional product "LCCNF2012KKTR24MAD" (operating temperature range: -55°C to +150°C) to 165°C, these new products are able to contribute to the miniaturization and performance enhancement of power supply circuits by enabling high-density mounting in high-temperature environments such as in automobiles.　　Mass production of these products began at our subsidiary, WAKAYAMATAIYO YUDEN CO., LTD. (Inami-cho, Hidaka-gun, Wakayama Prefecture, Japan), in April 2024. Samples are available for 50 yen per unit.　　The advancements that we have seen in recent years in electronic controls in production vehicles, as typified by ADAS units, has led to a greater number of power supply circuits on vehicles, which in turn has led to growth in the demand for power inductors that are used in these circuits. Furthermore, performance also continues to improve through functional integration, such as in integrated cockpits that combine instrument clusters and infotainment devices. While the throughput of IC chips continues to grow as these devices become increasingly multifunctional and high-performance, there is also a growing need to make on-board electronic components smaller and thinner in order to arrange devices in highly dense configurations and integrate them into single modules. Components mounted at high densities become more susceptible to the effects of heat, as their reduced volumes makes it more difficult for the heat generated by the components to dissipate. Furthermore, since ECUs are increasingly being installed in engine compartments—a high temperature environment—on-board electronic components must be able to withstand high temperatures.　　To address these challenges, TAIYO YUDEN further improved the reliability of the MCOIL™ LCCN series of multilayer metal power inductors, which had the advantage of being smaller and thinner, and launched the AEC-Q200 certified LACN series which provides an extended operating temperature range of - 55°C to +165°C.　　TAIYO YUDEN focuses on the development of products that meet market needs, and will continue to expand its power inductor product lineup.　　*1 As of May 30, 2024, according to TAIYO YUDEN study.　　■Application　　Choke coils in DC-DC converters used in automotive engine ECUs, control systems such as BMS, safety systems such as ABS, body-related systems such as ADAS, and information systems such as instrument clusters.　　■Characteristics　　*2 The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)　　*3 The temperature rise current value(Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)　　*4 The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value.　　* Derating of rated current is necessary depending on the ambient temperature. Please see our website below for detailed specifications

Key word：

TAIYO

Release time：2025-05-30 14:21 reading：238 Continue reading>>

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TAIYO YUDEN Expands Lineup of Multilayer Metal Power Inductors for Smartphones

　　TAIYO YUDEN CO., LTD. has begun mass production of three products, including the LSCND1412FETR47ME (1.4 x 1.2 x 0.65 mm; maximum height shown), in its MCOIL™ LSCN series of multilayer metal power inductors.　　These power inductors are for use as choke coils in the power circuits of smartphones. Retaining the same form factor as our previous product "LSCND1412FETR47MC" (1.4 x 1.2 x 0.65 mm), the DC superposition allowable current of our new "LSCND1412FETR47ME" has been increased by 20% to 3.6 A (previously 3.0 A), and its DC resistance has been reduced by 10% to 38 mΩ (previously 42 mΩ). These improvements contribute to boosting the performance of power supply circuits in smartphones, which are becoming increasingly sophisticated and multifunctional.　　Mass production of these products commenced at our subsidiary WAKAYAMATAIYO YUDEN CO. LTD. (Inami-cho, Hidaka-gun, Wakayama Prefecture, Japan). Samples are available for 50 yen per unit.　　Technology Background　　Smartphones are becoming increasingly sophisticated, with capabilities such as AI-based image and video editing, as well as voice and text translation. At the same time, there is demand for greater efficiency in order to keep their body small, and achieve long operating times with limited battery capacity. To achieve both high performance and high efficiency, a smartphone’s processor operates at high speeds with low voltage and high current, and employs a multi-core configuration where each core is equipped with its own power supply circuit, allowing it to improve both its processing power and efficiency by switching the cores used depending on load. This trend in power supply circuits has become particularly pronounced in cutting-edge smartphones, which require both high performance and high efficiency, and in recent years has led to an increase in the adoption of small and thin low-inductance power inductors capable of handling large currents.　　To address these needs, at TAIYO YUDEN we have been using metallic magnetic materials with high DC superposition characteristics to optimize the design and other aspects of our MCOIL™ LSCN series multilayer metal power inductors—which have the advantage of allowing them to be made more compact and thinner—commercializing three products, including “LSCND1412FETR47ME,” which deliver 20% greater DC superposition allowable current and 10% smaller DC resistance compared to our previous products.　　In response to market needs, we will continue to expand and improve our product lineup with higher functionality and reliability, as well as smaller and thinner products.　　■ Application　　For use as a choke coil for power circuits in smartphones and other devices.　　■Characteristics　　*1 The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)　　*2 The temperature rise current value(Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)　　*3 The rated current value is following either Idc1(max) or Idc2(max), which is the lower one.　　* “MCOIL” is a registered trademark or a trademark of TAIYO YUDEN CO., LTD. in Japan and other countries.　　* The names of series noted in the text are excerpted from part numbers that indicate the types and characteristics of the products, and therefore are neither product names nor trademarks.

Key word：

TAIYO

Release time：2025-05-30 13:51 reading：276 Continue reading>>

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Renesas Extends RZ/A MPU Line-up with RZ/A3M for Cost-Sensitive, Advanced HMI Solutions

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new high-performance microprocessor (MPU) in the RTOS-based RZ/A series that meets the growing demands of advanced human-machine interface (HMI) systems. The new RZ/A3M MPU comes with large SDRAM, SRAM and RTOS support to facilitate the seamless execution of complex tasks and real-time graphical displays. The RZ/A3M drives video and camera output on large LCD panels with resolutions up to 1280x800, addressing the display requirements in next-generation home appliances, industrial and office automation, healthcare devices and building control systems.　　Similar to its existing RZ/A3UL, the RZ/A3M features a 64-bit Arm® Cortex®-A55 core with a maximum operating frequency of 1 GHz and 128 KB (kilobytes) of on-chip SRAM. By integrating high-speed 128MB DDR3L-SDRAM in a single System-in-Package (SiP), the device eliminates the complex task of designing a high-speed signal interface for connecting external memory.　　Reducing System Cost with Built-in Memory and Simplified PCB Design　　The RZ/A3M is designed to reduce system costs and accelerate development. It supports both external NAND and NOR flash via QSPI for data and code storage. Paired with a driver, high-capacity NAND flash offers a cost-effective option for memory expansion. Additionally, the RZ/A3M's BGA package has a unique pin layout with two main rows positioned on the outside edge. This layout simplifies PCB routing and enables a low-cost, dual-layer printed wiring board design, providing significant cost and time savings. This memory integration simplifies PCB design by reducing the routing complexity and minimizing layout constraints.　　“I’m pleased to launch the RZ/A3M, the first RZ product with large built-in memory targeting high-function video/animation HMI performance while keeping overall system costs low,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “In addition, we aim to deliver a highly responsive user experience with high-quality, real-time graphics, and provide the ease of design and cost efficiency to help our customers build advanced HMI solutions quickly.”　　Comprehensive Development Environment　　Renesas offers a comprehensive HMI development environment that includes the Flexible Software Package (FSP), evaluation kits, development tools, and sample software. Graphical user interface (GUI) solutions from partner companies such as LVGL, Crank, SquareLine Studio, and Envox will be available for the RZ/A3M to facilitate rapid HMI graphics development.　　Key Features of RZ/A3M　　Arm Cortex-A55 CPU with a maximum operating frequency of 1GHz　　128KB SRAM with error correction, Built-in 128MB DDR3L SDRAM　　Graphics capabilities: LCD controller supporting resolutions up to 1280x800 (WXGA), parallel RGB and MIPI-DSI (4-lane) interfaces, 2D graphics drawing engine　　Peripheral functions: QSPI interface for serial NOR/NAND flash memory, SPI, I2C, SDHI, USB2.0, I2S, temperature sensor, timer　　Package: 244-pin LFBGA, 17mm x 17mm, 0.8mm pitch　　Renesas’ Comprehensive HMI Solutions　　Renesas offers a wide variety of HMI solutions ranging from the 32-bit RX and RA MCU families to the 64-bit RZ family supporting 4K displays. The RZ/A series, built on RTOS-based MPUs with fast startup, includes the new RZ/A3M, which delivers high-performance HMI capabilities with the same ease of use offered by MCUs using large memory capacity.　　Multi-HMI Winning Combination　　Renesas offers Multi-HMI Solution which combines the new RZ/A3M MPU with numerous compatible devices from its portfolio to offer HMI functions for appliances. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

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Renesas

Release time：2025-05-26 14:49 reading：311 Continue reading>>

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GigaDevice Launches New EtherCAT® SubDevice Controller Chip An Excellent Choice for Industrial Automation

　　GigaDevice (Stock Code: 603986), a leading semiconductor supplier, announced today the official launch of its EtherCAT® SubDevice Controller chip.　　GigaDevice has received official authorization from Beckhoff and launched its first EtherCAT® SubDevice Controller, GDSCN832, along with the ultra-high performance industrial automation MCU series GD32H75E, which incorporates the EtherCAT® SubDevice Controller. These new products are tailored to meet the demands of the industrial automation market, providing optimal solutions for applications such as servo control, variable frequency drives, industrial PLCs, and communication modules, thanks to their exceptional processing power and extensive interface resources. Samples and development boards are now available, with mass production scheduled for 2nd quarter of 2025.　　GigaDevice EtherCAT® SubDevice Controller Chip　　EtherCAT® SubDevice Controller: Achieving Ultra-Fast Response Time　　The GDSCN832 series is a 2/3-port EtherCAT® SubDevice Controller integrating two internal PHYs and one MII extension interface. It has a dual-channel integrated Ethernet physical layer device, with each channel offering a full-duplex 100BASE-TX transceiver supporting 100 Mbps operation. This series supports eight Fieldbus Memory Management Units (FMMU), enhancing data processing performance and security while effectively reducing memory access latency to improve system response time and real-time performance, providing users with high flexibility in data mapping. Additionally, it supports eight Sync Manager entities for efficient memory management.　　The GDSCN832 series includes up to 8 KB of Dual-Port RAM (DPRAM), facilitating large data processing capabilities for complex control systems. It incorporates a 64-bit distributed clock with a host bus interface that achieves equivalent functionality through high-speed synchronous/asynchronous device interfaces, with a precision below 1 µs. This product series supports 8/16-bit serial/parallel port communication, SPI/QSPI/OSPI device interfaces with communication speeds up to 100 MHz, and EXMC synchronous mode. Its diverse interface options provide users with greater flexibility in interface configuration. An integrated 1.1V core regulator supports operation with a single 3.3V power supply and allows for variable voltage I/O from 1.8V to 3.3V. The GDSCN832 supports HP Auto-MDIX, enabling direct or crossover LAN cable connections. Four low-power modes are available to balance energy efficiency and power consumption.　　With its high integration, flexibility, and stability, the GDSCN832 is ideal for applications such as motor motion control, data acquisition, industrial automation, communication modules, and sensors. The series comes in a compact QFN64 package, along with a development and evaluation board, providing a cost-effective EtherCAT® SubDevice Controller device solution for developers.　　GD32H75E Series EtherCAT® Industrial Automation MCUs: Combining Superior Control and Efficient Communication Capabilities　　GigaDevice has launched the GD32H75E series, its first high-performance MCU product authorized by Beckhoff to integrate the EtherCAT® SubDevice Controller. Combining the GDSCN832 series chip with a high-performance MCU, this product offers a seamless solution for diverse industrial automation applications, including servo motor control, variable frequency drives, industrial PLCs, and communication modules.　　Building on the exceptional features of the GD32H7 series, the GD32H75E series uses an Arm® Cortex®-M7 high-performance core with a frequency of up to 600 MHz. It includes an advanced DSP hardware accelerator, a double-precision floating-point unit (FPU), a hardware trigonometric accelerator (TMU), and a filter algorithm accelerator (FAC). The series offers on-chip Flash memory ranging from 1024 KB to 3840 KB and 1024 KB of SRAM, with 512 KB configurable tightly coupled memory (ITCM, DTCM) for zero-wait execution of critical instructions and data. All Flash and SRAM regions support ECC verification, enhancing system reliability. Additionally, it features a 64 KB L1-Cache (I-Cache, D-Cache) to further improve CPU efficiency and real-time performance.　　The GD32H75E provides a wealth of peripheral resources, including 8 USARTs, 4 I2Cs, 6 SPIs, 4 I2S, and an 8-line OSPI (backward compatible with 4-line QSPI). It supports 2 USB 2.0 OTG interfaces with Full Speed and High Speed modes and includes 3 CAN-FD controllers. The series also features four 32-bit general-purpose timers, twelve 16-bit general-purpose timers, four 64-bit/32-bit basic timers, and two advanced PWM timers. Two 14-bit ADCs provide sampling rates up to 4 MSPS, with one 12-bit ADC reaching 5.3 MSPS, along with a fast comparator (COMP) and DAC for high-precision analog functions. A high-performance digital filter module (HPDF) for external Σ-Δ modulators and an encoder divide output controller (EDOUT) are also integrated, making it ideal for high-precision motion control systems.

Key word：

GigaDevice

Release time：2025-05-21 16:53 reading：355 Continue reading>>

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GigaDevice launches the GD32G5 series high-performance MCUs with Cortex®-M33 core, unleashing innovation potential in industrial applications

　　GigaDevice (Stock Code: 603986), a leading semiconductor supplier, today officially announced the launch of the GD32G5 series high-performance microcontrollers, based on the Arm® Cortex®-M33 core.　　The GD32G5 series MCUs, featuring exceptional processing performance, a wide range of digital and analog interface resources, and enhanced security capabilities, can be widely applied across diverse scenarios such as digital power systems, charging stations, energy storage inverters, frequency converters, servo motors, and optical communication. This new product lineup offers 14 models across 7 package types, including LQFP, QFN, and WLCSP. 　　Powerful Performance Empowering the Industrial Market　　The GD32G5 series MCUs are powered by the high-performance Arm® Cortex®-M33 core, with a clock frequency of up to 216 MHz. These MCUs feature an advanced DSP hardware accelerator and a single-precision floating-point unit (FPU). They also integrate a hardware trigonometric function accelerator (TMU), supporting 10 types of function calculations, along with various other hardware acceleration units, including filter algorithms (FAC) and Fast Fourier Transform (FFT), which significantly enhance processing efficiency. At maximum frequency, the GD32G5 series MCUs deliver performance of up to 316 DMIPS, achieving an impressive CoreMark® score of 694.　　The GD32G5 series MCUs are equipped with 256KB to 512KB of embedded Flash memory, supporting the dual-bank Flash feature, and 128KB of SRAM, which includes 32KB Tightly Coupled Memory RAM (TCMRAM) for zero-wait execution of critical instructions and data. Additionally, they feature high-speed cache memory, with up to 2KB I-Cache and 512B D-Cache, further boosting core processing performance.　　Extensive Peripherals Enable Development Innovation　　The GD32G5 series MCUs integrate a comprehensive range of peripheral resources. They support four 12-bit ADCs with a sampling rate of up to 5.3 MSPS and up to 42 channels, as well as four 12-bit DACs, two of which offer sampling rates as high as 15 MSPS. Additionally, the series includes eight high-speed comparators (COMPs) and a suite of high-precision analog peripherals designed to meet the demands of motor and power control applications. The GD32G5 series also features a 16-channel high-precision timer (HRTimer) with accuracy reaching 145 ps, along with three advanced 8-channel timers, two 32-bit general-purpose timers, five 16-bit general-purpose timers, two 16-bit basic timers, and one low-power timer.　　In terms of communication interfaces, the GD32G5 series offers five U(S)ARTs, four I2Cs, three SPIs, and one QSPI supporting up to 200 MHz DDR/SDR interfaces. The MCUs are equipped with three CAN-FD modules, ideal for high-speed communication applications. Additionally, they integrate one HPDF (high-performance digital filter) supporting 8 channels and 4 filters, with external Σ-Δ modulator support. The series also includes four configurable logic modules (CLAs) and the Trigsel module, which allows flexible configuration of trigger sources. Designed to operate in a wide temperature range from -40°C to 105°C, the GD32G5 series is well-suited for demanding applications such as optical modules, industrial power supplies, and high-speed motor control, where stringent temperature requirements must be met.

Key word：

GigaDevice

Release time：2025-05-21 16:47 reading：361 Continue reading>>

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EMC components: TDK offers multilayer chip beads with the industry's highest rated current of 8 A for power supply lines

　　TDK Corporation (TSE: 6762) has expanded its MPZ1608-PH series of large-current multilayer chip beads for automotive and commercial power supply lines (1.6 x 0.8 x 0.6 mm – L x W x H). Mass production of the product series began in May 2025.　　These 1608-size chip beads for power supply lines achieve a rated current of 8 A, the industry’s highest value*. Chip beads are used as noise suppression components in power and signal circuits. In a circuit with a current of 8 A or more, usually two or more chip beads must be used in parallel. This has the disadvantage that the current is not evenly distributed between the ferrite beads. TDK’s new product simplifies the circuit structure because fewer components are required compared to conventional methods, and it improves the quality of power circuits.　　The MPZ1608-PH series of products halves the component footprint in comparison with circuits using two conventional 1608-sized chip beads. Moreover, the highly reliable components with a specified operating temperature of up to +125 °C are designed to be used in high-temperature environments like automotive and industrial equipment applications.　　With TDK’s proprietary materials and structural designs adapted to market needs, the company is committed to expanding its lineup of high rated current products in the automotive, industrial equipment, and consumer equipment areas. These chip beads will serve as EMC components contributing to the enhancement of the quality of power circuits.　　Glossary　　EMC: electromagnetic compatibility　　Main applications　　Power circuit for different pieces of equipment: in-vehicle ECUs, power train, vehicle body control, automotive multimedia (telematics), base stations, PCs, servers, set-top box, smart grids, robots, smartphones, tablet devices, etc.　　Main features and benefits　　Compatible with large currents as high as 8 A　　Reduces components and footprint　　Highly reliable; can be used in high-temperature environments like automotive applications　　Key data

Key word：

TDK

Release time：2025-05-16 13:45 reading：320 Continue reading>>

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BIWIN Domestically-Produced eMMC for the Power Industry is Officially Launched

　　In response to the high-standard requirements of data storage for the sake of intelligence development in the electric power industry, BIWIN Spec has officially launched 100% domestically-produced power-specific eMMC, which achieves self-sufficiency from IC design and controller R&D to wafer fabrication, capable of providing secure, reliable and strong storage foundation for the power industry.　　True Industrial-Grade Design, Enhanced Stability and Reliability　　BIWIN’s power-specific eMMC supports wide-temperature operations from -40℃ to 105℃ (Max), excelling in various extreme conditions. In line with the industrial-grade hardware design standards and equipped with reinforced electromagnetic interference (EMI) resistance, the product has been validated by over 1,000 industrial specialized tests, able to offer beyond 10 years of stable operations.　　Self-Developed Controller and Firmware Algorithm, Exceptional Workload Capability　　　BIWIN power-specific eMMC, featured with a self-developed controller, is characterized by efficiently optimized design particularly in power consumption, performance and reliability, offering reduced data transfer latency and also more efficient and stable storage experience. The built-in specialized software algorithms tailored to power industry secure operational continuity, including technical properties such as FFU OTA with zero downtime, power loss protection, S.M.A.R.T., and operational log access. The product also supports pSLC mode, granting extended lifespan with over 30,000 P/E cycles; meanwhile, the inbuilt advanced resource scheduling algorithms—including garbage collection (GC), Trim, and wear leveling for both dynamic and static writes—further maximize product lifespan and performance stability.　　Superior Integrated Performance, Compatible with Diversified Power Equipment　　　Engineered in full compliance with power industry standards, BIWIN's eMMC covers the complete development cycle—from product definition and software/hardware algorithm to testing and manufacturing. With capacities ranging from 16GB-128GB and read/write speeds up to 330MB/s and 220MB/s respectively, this eMMC is qualified for the demand of “high frequency in small data streams”in power industry, ideal for data collectors, protection devices, concentrators, and integrated terminals.　　Beyond the newly-launched power-specific eMMC, BIWIN has leveraged its technical edges in “Integrated Solution and Manufacturing”(ISM) to establish the all-scenario solutions for the power industry, consisting of industrial-grade SODIMM/UDIMM, SATA/PCIe SSD, storage cards, LPDDR4X, and Nor Flash in multiple form factors and dimensions, supporting the full spectrum of digital-intelligent operations in modern power systems.

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BIWIN

Release time：2025-05-14 14:26 reading：403 Continue reading>>

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